Size: 3"~17"
Thickness: 10mm
Grits available: 30#, 50#, 100#, 200#
Application:
This spogne base ceramic bond polishing pad is our latest design, The sponge base design makes it soft and flexible, it can greatly reduce the impact on machine, and it is better to fit the floor surface and grinding more finely.
Ceramic transitional pads are designed for an effortless transition from metals to resins. The aggressive ceramic and diamond matrix has been designed to remove deeper scratches left behind by the metal bond stages, eliminating the need for multiple passes with metals. The ceramic has an impressive triple filtered diamond content ratio allowing for an aggressive cut and perfectly consistent scratch pattern.
